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Experimental modal analysis and dynamic response of PC boards with surface mount electronic components
Title
Experimental modal analysis and dynamic response of PC boards with surface mount electronic components.
Creator
Wang, Gang., Florida Atlantic University, Wong, Tin-Lup, College of Engineering and Computer Science, Department of Ocean and Mechanical Engineering
Abstract/Description
Experimental modal analysis was conducted on a FR-4 epoxy fiber glass electronic printed circuit board (PCB) and a same size PCB with surface mount component to determine the modal parameters of the first four flexural vibration modes. Structural dynamic modification (SDM) and finite element analysis (FEA) techniques were utilized to predict the dynamic behavior of the boards when surface mount assemblies were attached. Details of modal testing procedures and analytical modeling involved in...
Show moreExperimental modal analysis was conducted on a FR-4 epoxy fiber glass electronic printed circuit board (PCB) and a same size PCB with surface mount component to determine the modal parameters of the first four flexural vibration modes. Structural dynamic modification (SDM) and finite element analysis (FEA) techniques were utilized to predict the dynamic behavior of the boards when surface mount assemblies were attached. Details of modal testing procedures and analytical modeling involved in SDM and FEA were described. Processes of investigating suitable predicting model were presented. Results from the study indicate that the component can be modeled as a point mass under certain circumstance. But it is important to include the rotary inertia effects of the component in response prediction for the modes involving torsional vibration.
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Date Issued
1990
PURL
http://purl.flvc.org/fcla/dt/14671
Subject Headings
Printed circuits--Testing, Electronic packaging, Surface mount technology
Format
Document (PDF)
Mathematical modeling techniques applied to EMI prediction in printed circuit boards
Title
Mathematical modeling techniques applied to EMI prediction in printed circuit boards.
Creator
Perez-Rodriguez, Reinaldo J., Florida Atlantic University, Ungvichian, Vichate, College of Engineering and Computer Science, Department of Computer and Electrical Engineering and Computer Science
Abstract/Description
A formulation with its computer code based on the method of moments for thin wire structures is used for modeling the radiated fields emanated from a multilayer PCB. The moment method modeling technique proves to be a valuable tool for EMI prediction in a PCB at radio frequencies as well as useful design technique for obtaining the PCB layout which produces the least amount of radiation. A new modeling of the current distribution which includes the effect of microstrip open-end and bend...
Show moreA formulation with its computer code based on the method of moments for thin wire structures is used for modeling the radiated fields emanated from a multilayer PCB. The moment method modeling technique proves to be a valuable tool for EMI prediction in a PCB at radio frequencies as well as useful design technique for obtaining the PCB layout which produces the least amount of radiation. A new modeling of the current distribution which includes the effect of microstrip open-end and bend discontinuities is used. The new modeling increases the accuracy of the prediction model for calculating the radiated EMI. The applicability of the moment method technique for studying the current distribution of wide microstrip is shown by modeling the existence of longitudinal and transverse currents at bend discontinuities.
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Date Issued
1989
PURL
http://purl.flvc.org/fcla/dt/11931
Subject Headings
Printed circuits--Design and construction, Electromagnetic interference
Format
Document (PDF)
Effects of added components on the dynamic modeling of printed circuit boards
Title
Effects of added components on the dynamic modeling of printed circuit boards.
Creator
Vallamattam, Bijoy Kurian., Florida Atlantic University, Stevens, Karl K., College of Engineering and Computer Science, Department of Ocean and Mechanical Engineering
Abstract/Description
Dynamic modeling of Printed Circuit Boards (PCBs) with mounted components, was investigated via the example of a PC network card by removing components in different stages and examining the resulting effects on the modal properties. Modal test results were compared with those from an ANSYS finite element analysis. Questions considered were: a) Do added components have a significant effect on the modal properties of a PCB and what are the effects ? b) How much variation is there in natural...
Show moreDynamic modeling of Printed Circuit Boards (PCBs) with mounted components, was investigated via the example of a PC network card by removing components in different stages and examining the resulting effects on the modal properties. Modal test results were compared with those from an ANSYS finite element analysis. Questions considered were: a) Do added components have a significant effect on the modal properties of a PCB and what are the effects ? b) How much variation is there in natural frequencies from board to board and test to test for a single board? c) Can a board with attached components reasonably be modeled as a uniform elastic plate with an "equivalent" density and modulus of elasticity? Results obtained indicate that added components do have significant effects on the board modal properties, less so for the lower modes than for the higher modes. There was only slight variation in the natural frequencies from board to board and from test to test for a single board. For the first two modes of vibration, it was found that the board considered could be modeled as a uniform elastic plate with "equivalent" properties, provided an appropriate value of equivalent elastic modulus was used. General findings, applicable to any PCB design, are presented.
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Date Issued
1994
PURL
http://purl.flvc.org/fcla/dt/15015
Subject Headings
Modal analysis, Printed circuits--Mathematical models, Printed circuits--Design and construction--Data processing, Electronic systems
Format
Document (PDF)
Hybrid reliability analysis of surface mounted assemblies
Title
Hybrid reliability analysis of surface mounted assemblies.
Creator
Wang, Junshi., Florida Atlantic University, Wong, Tin-Lup, College of Engineering and Computer Science, Department of Ocean and Mechanical Engineering
Abstract/Description
Simulations of bending and twisting of surface mounted assemblies have been performed using the hybrid analytical/experimental analysis approaches, and the results are presented. Analytical analyses were combined with experimental load-deformation characteristics of the surface mounted assemblies to predict the maximum allowable loadings and deflections that surface mounted assemblies can withstand before incurring failures. Simulation results obtained were in close agreement with the real...
Show moreSimulations of bending and twisting of surface mounted assemblies have been performed using the hybrid analytical/experimental analysis approaches, and the results are presented. Analytical analyses were combined with experimental load-deformation characteristics of the surface mounted assemblies to predict the maximum allowable loadings and deflections that surface mounted assemblies can withstand before incurring failures. Simulation results obtained were in close agreement with the real loading situations.
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Date Issued
1990
PURL
http://purl.flvc.org/fcla/dt/14611
Subject Headings
Printed circuits--Design and construction, Electronic packaging, Surface mount technology
Format
Document (PDF)
Object-oriented process planning system for printed circuit boards fabrication (OOPP)
Title
Object-oriented process planning system for printed circuit boards fabrication (OOPP).
Creator
Alif, Nidal M., Florida Atlantic University, Han, Chingping (Jim)
Abstract/Description
An Object-Oriented Process Planning (OOPP) system that generates a particular process plan for Printed Circuit Board (PCB) fabrication is developed. The OOPP is an integrated system that access the manufacturing database, which includes the fabrication processes and the main parameters of Printed Circuit Boards. An Object-Oriented approach has several benefits which include a modular system structure that combine procedures (programs) with data values, improving the communication among...
Show moreAn Object-Oriented Process Planning (OOPP) system that generates a particular process plan for Printed Circuit Board (PCB) fabrication is developed. The OOPP is an integrated system that access the manufacturing database, which includes the fabrication processes and the main parameters of Printed Circuit Boards. An Object-Oriented approach has several benefits which include a modular system structure that combine procedures (programs) with data values, improving the communication among different manufacturing activities, and achieving less system maintenance and down stream errors. OOPP system based on Group Technology (GT) concept and PCB fabrication rules. Applying Group Technology within Object Oriented process planning structure is a new application in this field. This gives more flexibility to the system and presents a technique that intends future reuse.
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Date Issued
1991
PURL
http://purl.flvc.org/fcla/dt/14761
Subject Headings
Production planning--Data processing, Object-oriented programming (Computer science), Printed circuits
Format
Document (PDF)