You are here

Mode I interlaminar fracture toughness of interleaved graphite/epoxy

Download pdf | Full Screen View

Date Issued:
1991
Summary:
Mode I interlaminar fracture toughness, G IC, of interleaved graphite/epoxy has been investigated with DCB specimens, beam theory, and finite element analysis. Finite element modeling aimed to investigate the influence of interleaf thickness on compliance and energy release rate and possible mixed mode loading in the case of asymmetric interfacial crack. Another objective was to compute crack tip yield zone dimensions as a function of thickness and elastic properties of the interleaf material. The analysis is correlated with experiments. Thermoplastic interleaves enhanced G IC to a great extent. The toughness increased sharply with film thickness to a maximum at 16 mu m and decreased for the thicker interleaves. On the other hand, inadequate adhesion preempted the toughness potential of thermoset interleaves.
Title: Mode I interlaminar fracture toughness of interleaved graphite/epoxy.
0 views
0 downloads
Name(s): Ozdil, Feridun.
Florida Atlantic University, Degree grantor
Carlsson, Leif A., Thesis advisor
College of Engineering and Computer Science
Department of Ocean and Mechanical Engineering
Type of Resource: text
Genre: Electronic Thesis Or Dissertation
Issuance: monographic
Date Issued: 1991
Publisher: Florida Atlantic University
Place of Publication: Boca Raton, Fla.
Physical Form: application/pdf
Extent: 145 p.
Language(s): English
Summary: Mode I interlaminar fracture toughness, G IC, of interleaved graphite/epoxy has been investigated with DCB specimens, beam theory, and finite element analysis. Finite element modeling aimed to investigate the influence of interleaf thickness on compliance and energy release rate and possible mixed mode loading in the case of asymmetric interfacial crack. Another objective was to compute crack tip yield zone dimensions as a function of thickness and elastic properties of the interleaf material. The analysis is correlated with experiments. Thermoplastic interleaves enhanced G IC to a great extent. The toughness increased sharply with film thickness to a maximum at 16 mu m and decreased for the thicker interleaves. On the other hand, inadequate adhesion preempted the toughness potential of thermoset interleaves.
Identifier: 14682 (digitool), FADT14682 (IID), fau:11473 (fedora)
Collection: FAU Electronic Theses and Dissertations Collection
Note(s): College of Engineering and Computer Science
Thesis (M.S.)--Florida Atlantic University, 1991.
Subject(s): Laminated materials--Testing
Fracture mechanics
Strength of materials
Held by: Florida Atlantic University Libraries
Persistent Link to This Record: http://purl.flvc.org/fcla/dt/14682
Sublocation: Digital Library
Use and Reproduction: Copyright © is held by the author, with permission granted to Florida Atlantic University to digitize, archive and distribute this item for non-profit research and educational purposes. Any reuse of this item in excess of fair use or other copyright exemptions requires permission of the copyright holder.
Use and Reproduction: http://rightsstatements.org/vocab/InC/1.0/
Host Institution: FAU
Is Part of Series: Florida Atlantic University Digital Library Collections.