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Mode I interlaminar fracture toughness of interleaved graphite/epoxy
- Date Issued:
- 1991
- Summary:
- Mode I interlaminar fracture toughness, G IC, of interleaved graphite/epoxy has been investigated with DCB specimens, beam theory, and finite element analysis. Finite element modeling aimed to investigate the influence of interleaf thickness on compliance and energy release rate and possible mixed mode loading in the case of asymmetric interfacial crack. Another objective was to compute crack tip yield zone dimensions as a function of thickness and elastic properties of the interleaf material. The analysis is correlated with experiments. Thermoplastic interleaves enhanced G IC to a great extent. The toughness increased sharply with film thickness to a maximum at 16 mu m and decreased for the thicker interleaves. On the other hand, inadequate adhesion preempted the toughness potential of thermoset interleaves.
Title: | Mode I interlaminar fracture toughness of interleaved graphite/epoxy. |
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Name(s): |
Ozdil, Feridun. Florida Atlantic University, Degree grantor Carlsson, Leif A., Thesis advisor College of Engineering and Computer Science Department of Ocean and Mechanical Engineering |
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Type of Resource: | text | |
Genre: | Electronic Thesis Or Dissertation | |
Issuance: | monographic | |
Date Issued: | 1991 | |
Publisher: | Florida Atlantic University | |
Place of Publication: | Boca Raton, Fla. | |
Physical Form: | application/pdf | |
Extent: | 145 p. | |
Language(s): | English | |
Summary: | Mode I interlaminar fracture toughness, G IC, of interleaved graphite/epoxy has been investigated with DCB specimens, beam theory, and finite element analysis. Finite element modeling aimed to investigate the influence of interleaf thickness on compliance and energy release rate and possible mixed mode loading in the case of asymmetric interfacial crack. Another objective was to compute crack tip yield zone dimensions as a function of thickness and elastic properties of the interleaf material. The analysis is correlated with experiments. Thermoplastic interleaves enhanced G IC to a great extent. The toughness increased sharply with film thickness to a maximum at 16 mu m and decreased for the thicker interleaves. On the other hand, inadequate adhesion preempted the toughness potential of thermoset interleaves. | |
Identifier: | 14682 (digitool), FADT14682 (IID), fau:11473 (fedora) | |
Collection: | FAU Electronic Theses and Dissertations Collection | |
Note(s): |
College of Engineering and Computer Science Thesis (M.S.)--Florida Atlantic University, 1991. |
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Subject(s): |
Laminated materials--Testing Fracture mechanics Strength of materials |
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Held by: | Florida Atlantic University Libraries | |
Persistent Link to This Record: | http://purl.flvc.org/fcla/dt/14682 | |
Sublocation: | Digital Library | |
Use and Reproduction: | Copyright © is held by the author, with permission granted to Florida Atlantic University to digitize, archive and distribute this item for non-profit research and educational purposes. Any reuse of this item in excess of fair use or other copyright exemptions requires permission of the copyright holder. | |
Use and Reproduction: | http://rightsstatements.org/vocab/InC/1.0/ | |
Host Institution: | FAU | |
Is Part of Series: | Florida Atlantic University Digital Library Collections. |