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Experimental modal analysis and dynamic response of PC boards with surface mount electronic components

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Date Issued:
1990
Summary:
Experimental modal analysis was conducted on a FR-4 epoxy fiber glass electronic printed circuit board (PCB) and a same size PCB with surface mount component to determine the modal parameters of the first four flexural vibration modes. Structural dynamic modification (SDM) and finite element analysis (FEA) techniques were utilized to predict the dynamic behavior of the boards when surface mount assemblies were attached. Details of modal testing procedures and analytical modeling involved in SDM and FEA were described. Processes of investigating suitable predicting model were presented. Results from the study indicate that the component can be modeled as a point mass under certain circumstance. But it is important to include the rotary inertia effects of the component in response prediction for the modes involving torsional vibration.
Title: Experimental modal analysis and dynamic response of PC boards with surface mount electronic components.
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Name(s): Wang, Gang.
Florida Atlantic University, Degree grantor
Wong, Tin-Lup, Thesis advisor
College of Engineering and Computer Science
Department of Ocean and Mechanical Engineering
Type of Resource: text
Genre: Electronic Thesis Or Dissertation
Issuance: monographic
Date Issued: 1990
Publisher: Florida Atlantic University
Place of Publication: Boca Raton, Fla.
Physical Form: application/pdf
Extent: 95 p.
Language(s): English
Summary: Experimental modal analysis was conducted on a FR-4 epoxy fiber glass electronic printed circuit board (PCB) and a same size PCB with surface mount component to determine the modal parameters of the first four flexural vibration modes. Structural dynamic modification (SDM) and finite element analysis (FEA) techniques were utilized to predict the dynamic behavior of the boards when surface mount assemblies were attached. Details of modal testing procedures and analytical modeling involved in SDM and FEA were described. Processes of investigating suitable predicting model were presented. Results from the study indicate that the component can be modeled as a point mass under certain circumstance. But it is important to include the rotary inertia effects of the component in response prediction for the modes involving torsional vibration.
Identifier: 14671 (digitool), FADT14671 (IID), fau:11463 (fedora)
Collection: FAU Electronic Theses and Dissertations Collection
Note(s): College of Engineering and Computer Science
Thesis (M.S.)--Florida Atlantic University, 1990.
Subject(s): Printed circuits--Testing
Electronic packaging
Surface mount technology
Held by: Florida Atlantic University Libraries
Persistent Link to This Record: http://purl.flvc.org/fcla/dt/14671
Sublocation: Digital Library
Use and Reproduction: Copyright © is held by the author, with permission granted to Florida Atlantic University to digitize, archive and distribute this item for non-profit research and educational purposes. Any reuse of this item in excess of fair use or other copyright exemptions requires permission of the copyright holder.
Use and Reproduction: http://rightsstatements.org/vocab/InC/1.0/
Host Institution: FAU
Is Part of Series: Florida Atlantic University Digital Library Collections.