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combined FEM-fracture mechanics analysis approach for I.C. packages

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Date Issued:
1989
Summary:
A study of the stress distribution in and fracture behavior of the hermetic glass seal in a typical Integrated Circuit package is presented herein. Finite Element Analysis and Fracture Mechanics approaches were found effective for this investigation. A prescribed load or displacement applied at the tip of the lead protruding from the package causes high stresses at the lead-glass interface, which can lead to cracking and fracture of the seal. An approach for finding the value of the allowable load or displacement applicable at the lead tip is discussed. A correlation with a standard crack shape is presented for the 3-D model of the package. An extension of the problem revealing the effects of crack propagation on the stress intensity factor for the glass material is presented in later chapters. The J-integral method from Fracture Mechanics is found to be extremely useful for this investigation. A decline in the stress intensity factor with crack growth was observed from this study.
Title: A combined FEM-fracture mechanics analysis approach for I.C. packages.
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Name(s): Renavikar, Ajit Anand.
Florida Atlantic University, Degree grantor
Stevens, Karl K., Thesis advisor
College of Engineering and Computer Science
Department of Ocean and Mechanical Engineering
Type of Resource: text
Genre: Electronic Thesis Or Dissertation
Date Issued: 1989
Publisher: Florida Atlantic University
Place of Publication: Boca Raton, Fla.
Physical Form: application/pdf
Extent: 96 p.
Language(s): English
Summary: A study of the stress distribution in and fracture behavior of the hermetic glass seal in a typical Integrated Circuit package is presented herein. Finite Element Analysis and Fracture Mechanics approaches were found effective for this investigation. A prescribed load or displacement applied at the tip of the lead protruding from the package causes high stresses at the lead-glass interface, which can lead to cracking and fracture of the seal. An approach for finding the value of the allowable load or displacement applicable at the lead tip is discussed. A correlation with a standard crack shape is presented for the 3-D model of the package. An extension of the problem revealing the effects of crack propagation on the stress intensity factor for the glass material is presented in later chapters. The J-integral method from Fracture Mechanics is found to be extremely useful for this investigation. A decline in the stress intensity factor with crack growth was observed from this study.
Identifier: 14511 (digitool), FADT14511 (IID), fau:11309 (fedora)
Collection: FAU Electronic Theses and Dissertations Collection
Note(s): College of Engineering and Computer Science
Thesis (M.S.E.)--Florida Atlantic University, 1989.
Subject(s): Integrated circuits--Fracture
Fracture mechanics
Finite element method
Electronics--Materials--Fatigue
Held by: Florida Atlantic University Libraries
Persistent Link to This Record: http://purl.flvc.org/fcla/dt/14511
Sublocation: Digital Library
Use and Reproduction: Copyright © is held by the author, with permission granted to Florida Atlantic University to digitize, archive and distribute this item for non-profit research and educational purposes. Any reuse of this item in excess of fair use or other copyright exemptions requires permission of the copyright holder.
Use and Reproduction: http://rightsstatements.org/vocab/InC/1.0/
Host Institution: FAU
Is Part of Series: Florida Atlantic University Digital Library Collections.