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Debonding failure analysis of overmolded pad array carrier (OMPAC) integrated circuit packages

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Date Issued:
1991
Summary:
Recently developed electronic packages called Overmolded Pad Array Chip Carrier (OMPAC) IC packages frequently fail at the interface between the overmold compound and the substrate. In this study, this generic type of structure was evaluated by a combination of experimental and analytical methods. Model specimens representative of OMPAC structures were designed, manufactured and tested to failure. Detailed finite element models of the specimens were developed and analyses conducted to calculate debond stresses. Analytical methods were refined to include the effect of stress singularities. Stress results were averaged over a distance of.010 in. around the stress singularities to capture the intensity of the stress. These results were used in a combined stress failure criterion to calculate interfacial strengths based on macroscopic failure loads. The interfacial strengths were found to approach, but not exceed, those of the bulk overmold compound.
Title: Debonding failure analysis of overmolded pad array carrier (OMPAC) integrated circuit packages.
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Name(s): Hunt, Stephen Douglas.
Florida Atlantic University, Degree grantor
Carlsson, Leif A., Thesis advisor
Type of Resource: text
Genre: Electronic Thesis Or Dissertation
Issuance: monographic
Date Issued: 1991
Publisher: Florida Atlantic University
Place of Publication: Boca Raton, Fla.
Physical Form: application/pdf
Extent: 88 p.
Language(s): English
Summary: Recently developed electronic packages called Overmolded Pad Array Chip Carrier (OMPAC) IC packages frequently fail at the interface between the overmold compound and the substrate. In this study, this generic type of structure was evaluated by a combination of experimental and analytical methods. Model specimens representative of OMPAC structures were designed, manufactured and tested to failure. Detailed finite element models of the specimens were developed and analyses conducted to calculate debond stresses. Analytical methods were refined to include the effect of stress singularities. Stress results were averaged over a distance of.010 in. around the stress singularities to capture the intensity of the stress. These results were used in a combined stress failure criterion to calculate interfacial strengths based on macroscopic failure loads. The interfacial strengths were found to approach, but not exceed, those of the bulk overmold compound.
Identifier: 14778 (digitool), FADT14778 (IID), fau:11568 (fedora)
Collection: FAU Electronic Theses and Dissertations Collection
Note(s): College of Engineering and Computer Science
Thesis (M.S.E.)--Florida Atlantic University, 1991.
Subject(s): Thermal stresses
Integrated circuits
Held by: Florida Atlantic University Libraries
Persistent Link to This Record: http://purl.flvc.org/fcla/dt/14778
Sublocation: Digital Library
Use and Reproduction: Copyright © is held by the author, with permission granted to Florida Atlantic University to digitize, archive and distribute this item for non-profit research and educational purposes. Any reuse of this item in excess of fair use or other copyright exemptions requires permission of the copyright holder.
Use and Reproduction: http://rightsstatements.org/vocab/InC/1.0/
Host Institution: FAU
Is Part of Series: Florida Atlantic University Digital Library Collections.